Multilayer ceramics for various applications including high density module, high frequency module, semiconductor interposer and cavity package.
Functional block in hybrid IC enables downsizing and readily model changing as well as reduces inspection processes.
|Custom Hybrid IC||KA|
|Multi Chip Module||MCM|
|Minimum Ordered Quantity|
|Recommended Pad Dimensions|
|Packagings For Chip Components|
|Color code•Resistance marking•E series numbers|